Alphawave Semi is positioned to pioneer this effort with an HBM4 memory controller portfolio and recently announced 3nm, 24 Gbps die-to-die UCIe IP subsystem delivering 1.6 TB/s of bandwidth. In ...

An impedance analyzer is an electronic test instrument that measures the characteristic complex impedance curves of a ...

Verification tools are getting faster and capacity is increasing, but they still can't keep up with the problem space.

What a year it’s been for Arteris! Reflecting on 2024, the company achieved exciting milestones and breakthroughs that pushed ...

Multi-die designs require advanced parasitic extraction, power analysis, and physical checks. Multi-die designs leveraging ...

Silicon lifecycle management has evolved greatly in the past five years, moving from novel concept to a key part of design ...

Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time ...

As integrated circuit (IC) designs continue to scale, the demand for efficient power management, performance optimization and ...

Experts At The Table: One of the big challenges facing EDA companies is explaining to customers what's possible, how to streamline their designs, and what can be accomplished at what level of risk.

More than just the processor needs to be defined for standard operating systems. Profiles help a little, but still not enough ...

The packaging and assembly challenges posed by increasingly complex sensors and MEMS.

SEMI’s Maria Daniela Perez reviews the latest developments discussed at ITF Chip into the Future, hosted by imec at SEMICON ...